Duralco Thermally Conductive adhesives and potting 

compounds provide the heat dissipation required for many 

High Temperature Electronic and  Industrial applications. 

These ultra temp. adhesives combine Cotronics’ unique 

polymer system and special thermally conductive fillers to 

provide continuous service up to 650oF. 

Duralco Conductive Adhesives have excellent adhesion to 

glass, ceramics, metals and plastics. 

Resistant to most chemicals and solvents. 

They are ideal for all high temperature applications. 

Applications Include: 

! Removing the heat generated in many electronic applications including semi-conductors, rectifiers, high power devices,  etc. 

! Heat transfer applications, including bonding copper coils to reaction vessels for heating and or cooling. Heat tracing adhesive. etc. 

! Fabrication of heated, plastic forming tools and molds. 

Duralco . Major Constituent  128Ceramic  132 Aluminum  133 Aluminum  134Ceramic  135 Aluminum  

Features Max. Temperature  °F Volume Resistance (ohm-cm.) 2Thermal Conductivity (BTU in/oF hr Ft ) Viscosity (cps) Color No. of Components Mix Ratio Cure Cycle (Hrs. @ 75°F) Cure Cycle (Mins. @ 250°F)  Hi Electrical Resistance 500 1510 30 15,000 Tan 2 100/21 16 - 24 20   Hi Thermal Conductivity 500 610 40 36,500 Silver 2 100/27.3 16 - 24 5  High Temperature 600 610 40 36,500 Silver 2 100/30 4 hrs. @ 250 240  Electrically Resistant Grease 500 1610 35 Grease Tan 1 N. A. N. A. N. A.  Thermally Conductive Grease 500 N. A. 40 Grease Gray 1 N. A. N. A. N. A.  

Duralco 132 Dissipates 

Heat in a Semiconductor Device 

Duralco 128 - 500oF Ceramic Based 

Duralco 128 is highly thermally conductive, electrically 

resistant adhesive and potting compound. 

The ceramic fillers are carefully chosen to provide high 

thermal conductivity and high dielectric strength. 

Just mix the resin and hardener, apply and cure at room 

temp. Curing may be accelerated with mild heat. 

Duralco 132 - 500oF Aluminum Based 

Duralco 132 is an Aluminum Metal Filled Epoxy that cures 

at room temperature to form machinable, thermally 

conductive bond lines.  

Duralco 132 provides the maximum heat transfer available 

in a 500°F epoxy system. 

Can be supplied as a non-sag putty, Duralco 132P, for heat 

tracing applications. 

Users report 132 bonds copper coils to vessels for rapid 

heating and cooling in a critical chemical process. 

Used for bonding, assembling and heat tacking applications. 

Cat. No. Size Temp.            

Duralco 128.......8 oz..........500oF                 

Duralco 132......16 oz..........500oF 

Duralco 132P......8 oz..........500oF 

Duralco 133......16 oz..........600oF                      

Duralco 134.......8 oz..........500oF                               

Duralco 135 ......4 oz..........500oF 

Duralco 135 ...... 8 oz..........500oF 

Quantity Prices, Special Packing on Request