Most substrates are best prepared by cleaning with a 50:50 mixture of isopropyl alcohol (IPA)

and water* prior to applying 3M™ VHB™ Tapes.

Exceptions to this general procedure that may require additional surface preparation include:

• Heavy Oils: A degreaser or solvent-based cleaner may be required to remove heavy oil or

grease from a surface and should be followed by cleaning with IPA/water.

• Abrasion: Abrading a surface, followed by cleaning with IPA/water, can remove heavy dirt

or oxidation and can increase surface area to improve adhesion.

• Adhesion Promoters: Priming a surface can significantly improve initial and ultimate

adhesion to many materials such as plastics and paints.

• Porous Surfaces: Most porous and fibered materials such as wood, particleboard, concrete

etc. need to be sealed to provide a unified surface.

• Unique Materials: Special surface preparation may be needed for glass and glass-like

materials, copper and copper containing metals and plastics or rubber that contain

components that migrate (e.g. plasticizers).

*Note: These cleaner solutions contain greater than 250 g/l of volatile organic compounds (VOC). Please consult your

local Air Quality Regulations to be sure the cleaner is compliant. When using solvents, be sure to follow the manufacturer’s

precautions and directions for use when handling such materials.

General

Procedure

• To obtain optimum adhesion, the bondingsurfaces must be well unified, clean and

dry. Typical surface cleaning solvents are IPA/water mixture (rubbing alcohol) or

heptane.* (Steps A and B)

• Bond strength is dependent upon the amount of adhesive-to-surface contact

developed. Firm application pressure develops better adhesive contact and helps

improve bond strength. (Steps C and D) Generally, this means that the tape should

experience at least 15 psi (100 kPa) in roll down or platen pressure. (Sources- page #4)

• After application, the bond strength will increase as the adhesive flows

onto the surface. At room temperature,approximately 50% of the ultimate

strength will be achieved after 20 minutes, 90% after 24 hours and

100% after 72 hours. In some cases,bond strength can be increased and

ultimate bond strength can be achieved more quickly by exposure of the bond

to elevated temperatures (e.g. 150°F [66°C] for 1 hour).

PERCENT OF FULL BOND

Typical Bond Build Over Time

Step A:

Solvent wipe

Step B:

Wipe dry

Step C:

Apply tape to surface

Step D:

Roll finished joint