Hold in a refrigerator. (0-10℃)

・ It is recommended to use within 6 months from manufacturing date.

・ The solder paste should be used as quickly as possible once lid has been opened.

・ Unused solder paste in the jar should be refrigerated after re-applying the inner and outer lids.

・ Prior to usage, solder paste should be removed from refrigeration for over 2 hours

until it reaches room temperature.

・ We recommend to stir the solder paste by mixing machine before use it. When stir by a spatula,

open the jar after the solder paste is warmed up to room temperature and stir slowly to make

the paste homogeneous. Caution must be taken not to mix in air.

・ After shooting the solder paste, mount components immediately and let it pass through

reflow furnace.

・ Slowly heat the reflow furnace at 1.0 to 2.5℃/second till reaching 120 to 170℃.

Set peak temperature at 160 to 170℃ during pre-heating and 205 to 230℃ during reflow.

(Refer to next page.)

・ This solder paste corresponds to No-Clean process, however confirmation may be required

whether No-Clean process is applicable under user’s expectancy.

・ White residue (insulator) may appear after cleaning.

・ Solder paste must be wiped off from spatula by applying solvent such as alcohol immediately after use.

・ This solder paste includes Lead.

・ The solder paste is not edible.

・ The solder paste is for the industrial use only.

・ Avoid contact with eyes and skin.

・ Avoid inhalation of gases emitted by solder paste during use.

・ Provide proper ventilation.

・ If contact with skin, wiped off with like alcohol and wash with soap and water, immediately.

・ Use rubber gloves and protective glasses, if necessary.

・

Prepared

Junichi Okano Hideto Takayama

（No sign for copy）

5. Delivery:

Usually 2 weeks from acceptance of order.

Approved

3. Caution:

4. Notice:

≪HOW TO HANDLE Sn62U SS4M≫

2. How to Use: